AT DIVISION

The semiconductor industry's leading KoreaTechno Co.,Ltd.

Tape Mounter System
Wafer Mounting System
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Model

KT-WTM3001A

KT Wafer mounter system made for back lap grinded wafer handling, OHT, FAB Automation Various type of BG tape applicable KT Wafer mounter system made for back lap grinded wafer handling, OHT, FAB Automation Various type of BG tape applicable.

Specification
Wafer Size 300mm 12” (Normal Thickness 450~750um)
Dimension 1,897(W) x 2,120(D) x 2,080(H)mm
System Control Type PC Control
Carrier Application FOUP, Ring Magazine
Through put 19 sec / wafer(Without HOST)
Cleanness FFU Class 100 ULPA filter
Attach Tape Pre-cut, UV Cure Type
Option BCP Printer, UV Irradiation, Heating chuck
* FAB Automation: OHT, AGV with HOST

If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email

E-Mail : smlee@ktsemi.co.kr