Wafer Mounting System
Model
KT-WTM3001A
KT Wafer mounter system made for back lap grinded wafer handling, OHT, FAB Automation Various type of BG tape applicable KT Wafer mounter system made for back lap grinded wafer handling, OHT, FAB Automation Various type of BG tape applicable.
Specification
| Wafer Size | 300mm 12” (Normal Thickness 450~750um) |
|---|---|
| Dimension | 1,897(W) x 2,120(D) x 2,080(H)mm |
| System Control Type | PC Control |
| Carrier Application | FOUP, Ring Magazine |
| Through put | 19 sec / wafer(Without HOST) |
| Cleanness | FFU Class 100 ULPA filter |
| Attach Tape | Pre-cut, UV Cure Type |
| Option | BCP Printer, UV Irradiation, Heating chuck |
* FAB Automation: OHT, AGV with HOST
If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email
E-Mail : smlee@ktsemi.co.kr