AT DIVISION

The semiconductor industry's leading KoreaTechno Co.,Ltd.

VPD System
Auto Scanning System
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Model

KASS-5600

Wafer Surface Etching Scan Equipment Vapor phase decomposition(VPD) inductively coupled plasma-mass spectrometry(ICP-MS) is one of the most utilized analytical techniques to monitor trace metals on wafer surfaces.

Specification
Wafer Size 6”(150mm), 8”(200mm), 12”(300mm)
Dimension 1,730(W) x 1,850(D) x 1,970(H)mm
Weight Less than 700Kg
Application BPD Process
Through put 10 Wafer/hr (Full scan mode)
Wafer Size 6”(150mm), 8”(200mm), 12”(300mm)
Bulk Etching System
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Model

KTBES-2300

Wafer Surface Bulk Etching Scan Equipment Bulk Etching system is a full automatic sampling tool for scanning of contaminant particles, metal impurity of the wafer layer with chemical solution.

Specification
Applications Bulk etching
Etching Degree Time Etching or EPD (Option)
Thickness Range 0.5um ~ 100um
N₂ Control Syringe Pump 5mL 3-Port valve (Accuracy : < 1.0%)
Sample Capability 25 Sample Holder X 4 Block = 100 samples (User Option)

If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email

E-Mail : smlee@ktsemi.co.kr