Auto Scanning System

Model
KASS-5600
Wafer Surface Etching Scan Equipment Vapor phase decomposition(VPD) inductively coupled plasma-mass spectrometry(ICP-MS) is one of the most utilized analytical techniques to monitor trace metals on wafer surfaces.
Specification
Wafer Size | 6”(150mm), 8”(200mm), 12”(300mm) |
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Dimension | 1,730(W) x 1,850(D) x 1,970(H)mm |
Weight | Less than 700Kg |
Application | BPD Process |
Through put | 10 Wafer/hr (Full scan mode) |
Wafer Size | 6”(150mm), 8”(200mm), 12”(300mm) |
Bulk Etching System

Model
KTBES-2300
Wafer Surface Bulk Etching Scan Equipment Bulk Etching system is a full automatic sampling tool for scanning of contaminant particles, metal impurity of the wafer layer with chemical solution.
Specification
Applications | Bulk etching |
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Etching Degree | Time Etching or EPD (Option) |
Thickness Range | 0.5um ~ 100um |
N₂ Control | Syringe Pump 5mL 3-Port valve (Accuracy : < 1.0%) |
Sample Capability | 25 Sample Holder X 4 Block = 100 samples (User Option) |
If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email
E-Mail : smlee@ktsemi.co.kr