AT DIVISION

The semiconductor industry's leading KoreaTechno Co.,Ltd.

Auto Jar Packing & Unpacking System
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Model

BJKO17A-OHT

Auto Jar Packing System consist of 200, 300mm cassette-only load port and unload port for wafer jar boxes, wafer in the cassette can be packed or unpacked into a wafer jar box by the transfer robot.
And wafers are normally packed into a jar box with clean sheets.

Specification
Applications Wafer jar box packing and unpacking
applied wafer size 8" (200mm) 12" (300mm)
Weight 3,800kg
Cassette Type Open CST(P.P. Monsanto, Metal) FOUP, Auto FOSB
Throughput 100 Wafers / Hr
Options FAB Automation, BCR, OCR

If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email

E-Mail : smlee@ktsemi.co.kr