AT DIVISION

The semiconductor industry's leading KoreaTechno Co.,Ltd.

Auto Tape Detach System
Auto Tape Detach System
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Model

KTTD-230

Auto Tape Detach System made for separate the ring frame and adhesive tape after collecting gooddie chip Auto Tape Detach System made for separate the ring frame and adhesive tape after collecting gooddie chip.
And it designed tape disposal and recycle.
It support FAB Automation.

Specification
Applications Wafer jar box packing and unpacking
Applied wafer size 8”(200mm), 12”(300mm)
Weight 3,800kg
Cassette Type Open CST(P, P, Monsanto, Metal) FOUP, Auto FOSB
Through put 100 Wafers/Hr
Options FAB Automation, BCR, OCR

If you want to pruchase and have any questions please feel free to contact +82-31-781-0033 or email

E-Mail : smlee@ktsemi.co.kr